Production possibilities of Electron Consortium
Electron Consortium JSC has a working quality control system and is ISO 9001:2008 certified by Bureau Veritas.
Assembly of PCB's, modules and whole products
The assembly includes SMD and conventional (THR) assembly. The production line has a possibility to take limited series, as well as mass production. The production equipment allows flexibility and fast change of the produced items.
For limited series and test samples
Vacuum tweezers for SMD assembly - 4 units
Production capabilities - 800÷1000 components per hour
Minimum size of the component - 0402
REFLOW - SMT 2000 - Microprocessor controlled preheat/reflow station.
For medium-sized and large series
Pick & Place Automat - Fully Automatic Place System for SMD Components PLM2000
Pick & Place Automat - Fully Automatic Place System for SMD Components CLM9000 from ESSEMTEC AG, Switzerland
Production capabilities - 6000/4000 components per hour respectively
Minimum size of the component - 0201
REFLOW - TWS-1200 from TWS automation CARRARA - ITALIA, 5-zone with air convection.
Organization: The company makes the whole technological preparation from the file of the PCB, which includes the information about the placement of the components and the corresponding mark and value/type of the component.
The technological preparation includes:
production of a metal template for placing solder paste.
making an assembly program for the automatic placement machine (Pick&Place file).
colored templates for control and others.
Technological possibilities of the assembly
Minimum size of a component we have used - 0402.
Minimum raster (grid) of a multi-lead component like TQFP - 50 μm.
Our company works with materials only from reputable companies.
solder paste from KESTER – Electronic Assembly materials, type R290, R256 containing Sn62Pb36Ag02 and Leàd free paste, type TCS – 552 containing Sn95.5Ag3.8Cu0.7
solder wire from Alpha metals – No clean
flux type “RMA”, No-clean from KESTER for soldering precise leads with small raster and for repairs.
The technological process includes the following operations:
The metal template for placing solder paste is produced for both ways of doing SMD assembly – for the automatic placement machine and for the manual assembly.
The price is different for each order and is affected by the quantity, difficulty, need for technological tools, etc.
Our company has developed and introduced a lead-free technology for PCB assembly and takes orders for our foreign partners. The materials used - solder paste and solder wire - are LEAD-FREE. Our equipment allows the execution of the technological processes.
Climatic and mechanical testing
We have facilities (small climatic chambers and a vibration stand) for temperature cycles and mechanical stress testing of PCBs, modules and assembled devices and we regularly carry out such tests for some of our customers.
Production of PCBs
We use our subcontractors like SET AG – Ruse and Micron 20 – Sofia for the production of PCBs. The technological possibilities of those producers are:
minimum bus – 200 μm
minimum distance – 180 μm for FR4 material with 18 μm Cu
minimum plated hole 0,4mm
number of layers – up to 8
Both producers have guaranteed internal electric test (E-test) of the PCB.
Delivery of electronic components
We work with our subcontractors and we can provide all R, C, D, T components and the standard integrated circuits. The client can deliver only specific and specialized components.